12 inisi SiC Substrate N Ituaiga Lapopo'a Tele Talosaga RF Fa'atinoga
Fa'agata fa'atekinisi
12 inisi Silicon Carbide (SiC) Substrate Fa'amatalaga | |||||
Vasega | ZeroMPD Gaosiga Vasega(Z Vasega) | Gaosiga Fa'ata'atia Vasega(P Vasega) | Fa'ailoga Tulaga (D Vasega) | ||
Diamita | 3 0 0 mm~1305mm | ||||
mafiafia | 4H-N | 750μm±15μm | 750μm±25μm | ||
4H-SI | 750μm±15μm | 750μm±25μm | |||
Fa'asinomaga ole Wafer | Tu'u ese: 4.0° agai i le <1120 >±0.5° mo le 4H-N, I luga ole axis: <0001>±0.5° mo le 4H-SI | ||||
Micropipe Density | 4H-N | ≤0.4cm-2 | ≤4cm-2 | ≤25cm-2 | |
4H-SI | ≤5cm-2 | ≤10cm-2 | ≤25cm-2 | ||
Tete'e | 4H-N | 0.015~0.024 Ω·cm | 0.015~0.028 Ω·cm | ||
4H-SI | ≥1E10 Ω·cm | ≥1E5 Ω·cm | |||
Primary Flat Orientation | {10-10} ±5.0° | ||||
Primary Flat Umi | 4H-N | N/A | |||
4H-SI | Notch | ||||
Tuusaunoaga Tupito | 3 mm | ||||
LTV/TTV/Bow/Warp | ≤5μm/≤15μm/≤35 μm/≤55 μm | ≤5μm/≤15μm/≤35 □ μm/≤55 □ μm | |||
Talatala | Polani Ra≤1 nm | ||||
CMP Ra≤0.2 nm | Ra≤0.5 nm | ||||
Ta'eta'e Tu'u I le Malamalama Maualuluga Papatusi Hex I Malamalama Maualuga Maualuga Polytype Areas I le Malamalama Maualuga Vaaiga Carbon Inclusions Su'ega Sili Sili I luga o le Malamalama Maualuga | Leai Vaega fa'aopoopo ≤0.05% Leai Vaega fa'aopoopo ≤0.05% Leai | Fa'aputu umi ≤ 20 mm, tasi umi≤2 mm Vaega fa'aopoopo ≤0.1% Vaega fa'aopoopo≤3% Vaega fa'aopoopo ≤3% Fa'aopoopo umi≤1×wafer diameter | |||
Tipi Chips E Malamalama Malosi Maualuga | Leai se faatagaina ≥0.2mm lautele ma loloto | 7 faatagaina, ≤1 mm taitasi | |||
(TSD) Fa'ase'e fa'avili fa'a filo | ≤500 cm-2 | N/A | |||
(BPD) Fa'avae va'alele va'alele | ≤1000 cm-2 | N/A | |||
Silicon Surface Contamination E le Malamalama Maualuga | Leai | ||||
afifiina | Tele-wafer kaseti po'o se atigi apa e tasi | ||||
Fa'amatalaga: | |||||
1 Fa'agata fa'aletonu e fa'atatau i luga atoa o ga'o masi se'i vagana ai le pito e fa'ate'aina. 2E tatau ona siaki na'o mata Si. 3 O fa'amaumauga fa'aletonu e na'o le KOH wafers ua togitogia. |
Vaega Autu
1. Large Size Advantage: O le 12-inch SiC substrate (12-inch silicon carbide substrate) e ofoina atu le tele o le tasi-wafer area, e mafai ai ona sili atu tupe meataalo e gaosia i le wafer, ma faʻaitiitia ai tau o gaosiga ma faʻateleina fua.
2. Mea Maualuga Maualuga: O le maualuga o le vevela o le Silicon carbide ma le maualuga o le malepelepe malosi o le fanua e faʻaogaina ai le substrate 12-inisi mo le maualuga-voltage ma le tele o taimi, e pei o le EV inverters ma le faʻapipiʻiina vave.
3. Faʻagasologa Faʻatasi: E ui lava i le maualuga o le faigata ma le faʻagasologa o luʻitau o le SiC, o le 12-inch SiC substrate e maua ai faʻaletonu pito i lalo e ala i le faʻaogaina o le tipiina ma le faʻalelei, faʻaleleia le gaosiga o masini.
4. Pulea Maualuga Maualuga: Faʻatasi ai ma le sili atu o le faʻaogaina o le vevela nai lo mea faʻavae silicon, o le 12-inch substrate e faʻafeiloaʻi lelei ai le faʻafefe o le vevela i masini maualuga, faʻalauteleina le ola o meafaigaluega.
Talosaga Autu
1. Taavale eletise: O le 12-inch SiC substrate (12-inch silicon carbide substrate) o se vaega autu o le isi augatupulaga eletise eletise, e mafai ai ona faʻaogaina le tele o mea faʻaleleia e faʻaleleia ai le vaʻaia ma faʻaitiitia le taimi o le tau.
2. 5G Base Stations: SiC substrates tetele-tele e lagolago ai masini RF maualuga, faʻafeiloaʻi manaʻoga o nofoaga autu 5G mo le malosi maualuga ma maualalo le gau.
3.Sapalai Malosiaga Fa'ainisinia: I totonu o le la inverters ma smart grids, o le substrate 12-inisi e mafai ona tatalia voltage maualuga a'o fa'aitiitia le malosi.
4. Consumer Electronics: O lo'o fa'atau vave ma sapalai eletise nofoaga autu o fa'amatalaga e mafai ona fa'aaogaina 12-inisi SiC substrates e ausia ai le lapo'a fa'atusatusa ma le maualuga maualuga.
Au'aunaga a le XKH
Matou te faʻapitoa i auaunaga faʻapitoa mo le gaosiga o le 12-inisi SiC substrates (12-inisi silicon carbide substrates), e aofia ai:
1. Dicing & Polishing: La'ititi-fa'aleagaina, maualuga-flatness substrate faagasologa e fetaui ma manaoga o tagata faatau, fa'amautinoa le fa'atinoina o masini mautu.
2. Epitaxial Growth Support: Au'aunaga wafer epitaxial maualuga maualuga e faatelevave ai le gaosiga o chip.
3. Laiti-Batch Prototyping: Lagolago R&D fa'amaonia mo fa'alapotopotoga su'esu'e ma atina'e, fa'apu'upu'u ta'amilosaga atina'e.
4. Faufautua Fa'atekinisi: Fa'ai'uga fa'ai'uga fa'ai'uga mai le filifilia o meafaitino e fa'agasolo ai fa'atonuga, fesoasoani i tagata fa'atau e fa'ato'ilaloina lu'itau fa'agaioiga SiC.
Pe mo le tele o gaosiga poʻo faʻapitoa faʻapitoa, o matou 12-inisi SiC substrate 'auʻaunaga e fetaui ma au galuega faʻatino, faʻamalosia le alualu i luma faatekinolosi.


