Infrared Picosecond Dual-Platform Laser Cutting mea faigaluega mo Mata tioata/Quartz/Sapphire Processing

Fa'amatalaga Puupuu:

Aotelega fa'apitoa:
O le Infrared Picosecond Dual-Station Glass Laser Cutting System o se fofo fa'apisinisi-vasega fa'apitoa fa'ainisinia mo le sa'o sa'o o mea fa'ama'i. Fa'aauupegaina i le 1064nm infrared picosecond puna leisa (pulse width <15ps) ma se fausaga lua-station platform design, o lenei faiga e tuuina atu faaluaina le lelei o le gaosiga, e mafai ai ona faʻaogaina le lelei o mata tioata (eg, BK7, fused silica), tioata quartz, ma safaira (α-Al₂O₃) e oʻo atu i le Moh.
Pe a faatusatusa i lasers nanosecond masani po o auala tipi masini, o le Infrared Picosecond Dual-Station Glass Laser Cutting System ausia micron-level kerf lautele (tulaga masani: 20-50μm) e ala i se "malulu ablation" masini, ma se sone afaina vevela faatapulaaina i <5μm. O le faʻaogaina o le lua-station mode faʻateleina le faʻaogaina o meafaigaluega e 70%, ae o le faʻaogaina o le vaʻaiga faʻapitoa (CCD faʻatulagaina saʻo: ± 2μm) e lelei mo le gaosiga tele o vaega tioata faʻapipiʻi 3D (faʻataʻitaʻiga, tioata ufiufi telefoni, mata tioata atamai) i totonu o pisinisi faʻatau eletise. O le faiga e aofia ai masini faʻapipiʻiina / faʻapipiʻiina, lagolago 24/7 faʻaauau le gaosiga.

Auina imeli ia matou

Fa'amatalaga Oloa

Faailoga o oloa

Fa'ailoga autu

Ituaiga Laser	Infrared Picosecond
Tele o Fa'avae	700×1200 (mm)
	900×1400 (mm)
Otioti Mafiafia	0.03-80 (mm)
Saosaoa tipi	0-1000 (mm/s)
Tu'u Mata'i	<0.01 (mm)
Fa'aaliga: E mafai ona fa'avasegaina le lapopo'a o le fausaga.

Vaega Autu

1. Ultrafast Laser Tekonolosi:
· Picosecond-level pupu pupuu (10⁻¹²s) tu'ufa'atasia ma le MOPA fa'aogaina tekinolosi e maua ai le maualuga o le malosi o le malosi >10¹² W/cm².
· Infrared wavelength (1064nm) e ati i mea manino e ala i nonlinear absorption, puipuia ablation luga.
· Fa'atotonuga fa'apitoa fa'apipi'i fa'apipi'i fa'atosina fa'atupu fa'ato'aga tuto'atasi i le taimi e tasi.

2.Dual-Station Synchronization System:
· Granite-base lua laina afi laasaga (tulaga saʻo: ± 1μm).
· Taimi fesuia'i nofoaga <0.8s, fa'aagalue tutusa "fa'agaoioiga- utaina/la'u 'ese" fa'agaioiga.
· Tutoatasi le pulea o le vevela (23±0.5°C) i le nofoaga taʻitasi e faʻamautinoa ai le mautu o masini umi.

3.Intelligent Process Control:
· Tu'ufa'atasi mea fa'amaumauga tu'ufa'atasi (200+ tioata fa'ata'ita'i) mo le fa'atusaina fa'amaufa'ailoga otometi.
· Taimi moni mata'ituina plasma dynamically fetuutuunai malosi leisa (fetuuna'iga iugafono: 0.1mJ).
· Puipuiga pupuni ea faaitiitia pito micro-ta'eta'e (<3μm).
I se faʻataʻitaʻiga masani e aofia ai le 0.5mm-mafiafia sapphire wafer dicing, o le faiga e ausia ai le saoasaoa o le 300mm / s faʻatasi ai ma le togiina o fua <10μm, e fai ma sui o le 5x faʻaleleia lelei i luga o auala masani.

Tulaga lelei

1.Integrated lua-nofoaga tipi ma vaeluaina faiga mo le faagaoioiga fetuutuunai;
2.High-saosaoa machining o geometries lavelave faʻaleleia le faʻagasologa o le liuaina lelei;
3. Taper-leai se tipi tipi ma itiiti chipping (<50μm) ma le faagaoioia-saogalemu taulimaina;
4. Seamless suiga i le va o faʻamatalaga o oloa faʻatasi ma le faʻaogaina faʻaogaina;
5.Low fa'agaioiga tau, fua maualuga fua, consumable-saoloto ma le filogia-le faagasologa;
6.Zero fa'atupuina o slag, otaota vai po'o otaota vai fa'atasi ma fa'amaonia le fa'amaoni i luga o le fogaeleele;

Fa'ata'ita'iga fa'aaliga

Infrared picosecond lua-tulaga tioata leisa meafaigaluega tipi 5

Talosaga masani

1. Consumer Electronics Gaosiga:
· Sa'o sa'o le tipiina o le telefoni 3D ufiufi tioata (R-angle sa'o: ±0.01mm).
· Eli pu laiti i tioata matamata safaira (maualalo le avanoa: Ø0.3mm).
· Fa'amae'aina sone fe'avea'i tioata mo meapueata i lalo o le fa'aaliga.

2.Optical Component Gaosiga:
· Fa'ata'ita'iga fa'apipi'i mo fa'asologa o tioata AR/VR (tele foliga ≥20μm).
· Otioti fa'ai'o o prisms quartz mo leisa collimators (fa'apalepale tulimanu: ±15").
· Fa'asologa o fa'amatalaga o filiga infrared (tipi taper <0.5°).

3. Semiconductor afifiina:
· Fa'ata'ita'i e ala atu i le (TGV) fa'agaioiina i le tulaga o le wafer (tulaga va'aiga 1:10).
· Fa'ata'ita'i le Microchannel i luga o mea tioata mo meataalo microfluidic (Ra <0.1μm).
· Fa'ato'a fa'amuta fa'ase'e mo fa'aluma fa'aluma fa'alumaina MEMS.

Mo ta'avale LiDAR fa'amalama fa'amalama fa'amalama, o le faiga e mafai ai ona tipi fa'ata'ita'i 2mm mafiafia tioata quartz fa'atasi ai ma le tipi fa'atasi o le 89.5±0.3°, fa'amalieina mana'oga o su'ega vibration ta'avale.

Fa'agasolo Talosaga

Fa'ainisinia fa'apitoa mo le tipiina sa'o o mea ma'ale'ale/malō e aofia ai:
1. Matatioata masani & matatioata matatioata (BK7, silica fused);
2. Ma'a tioata Kuata & mea'ai safaira;
3. tioata fa'afefete & filiga fa'apitoa
4. Mea fa'ata
Mafai ona tipi fa'ata'oto ma sa'o lelei le viliina o pu i totonu (la'ititi Ø0.3mm)

Fa'avae Tipi Laser

O le laser e fa'atupuina pusi ultrashort ma le malosi maualuga e fegalegaleai ma le mea faigaluega i totonu ole femtosecond-to-picosecond timescales. A'o fa'asalalauina i meafaitino, e fa'alavelaveina e le la'au lona fausaga fa'amamafa e fai ai pu filamentation micron-scale. Fa'ata'ita'iina le va o pu e maua mai ai ta'eta'ei fa'atonutonu, lea e tu'ufa'atasia ma le fa'atekonolosi fa'apipi'i e maua ai le vaeluaga sa'o.

Fa'amanuiaga o le tipiina leisa

1. Tuʻufaʻatasiga faʻaautomatika maualuga (tuʻufaʻatasia tipi / faʻapipiʻi galuega) faʻatasi ai ma le maualalo o le mana faʻaaogaina ma le faʻafaigofieina o galuega;
2.Non-contact processing e mafai ai ona gafatia tulaga ese e le mafai ona maua e ala i auala masani;
3.Consumable-leai se fa'agaioiga fa'aitiitia tau ta'avale ma fa'aleleia le fa'aleleia o le siosiomaga;
4.Superior sa'o ma zero taper angle ma le fa'aumatiaina o mea faigaluega lona lua fa'aleagaina;
O le XKH e tu'uina atu auaunaga fa'apitoa mo a tatou faiga fa'apipi'i leisa, e aofia ai le fa'atulagaina o fa'atulagaga fa'avae, fa'ata'ita'iga fa'ata'otoga fa'apitoa, ma fofo fa'apitoa e fa'amalieina ai mana'oga fa'apitoa i le gaosiga o pisinisi eseese.