Ole Semiconductor Laser Lift-Off Equipment ose fofo fa'apitoa fa'apitoa e fa'ainisinia mo le fa'amama sa'o ma le le fa'afeso'ota'i o mea fa'apipi'i semiconductor e ala ile laser-induced techniques lift-off. O lenei faiga alualu i luma o loʻo i ai se sao taua i faiga faʻaonaponei semiconductor wafering, aemaise lava i le fausiaina o faʻamaʻi manifinifi ultra mo eletise eletise maualuga, LED, ma masini RF. E ala i le fa'atagaina o le tu'ueseeseina o mea manifinifi mai le tele o ingots po'o le foa'i substrates, Semiconductor Laser Lift-Off Equipment revolutionizes ingot thinning e ala i le aveesea o masini iliili, olo, ma vailaau etching laasaga.

O le fa'amama fa'aleaganu'u masani o mea semiconductor, e pei o le gallium nitride (GaN), silicon carbide (SiC), ma le safaira, e masani ona galue malosi, maumau, ma faigofie i microcracks poʻo faʻaleagaina luga. I se fa'afeagai, Semiconductor Laser Lift-Off Equipment e ofoina atu se mea e le fa'aleagaina, sa'o lelei e fa'aitiitia ai mea fa'aletonu ma fa'alavelave i luga ae fa'ateleina le gaosiga. E lagolagoina le tele o ituaiga tioata ma mea faʻapipiʻi ma e mafai ona tuʻufaʻatasia faʻatasi i luma poʻo le ogatotonu o laina gaosiga semiconductor.

Fa'atasi ai ma fa'amautu umi galu leisa, fa'aogaina fa'aoga fa'aoga, ma vacuum-compatible wafer chucks, o nei meafaigaluega e matua fetaui lelei lava mo le slicing ingot, lamella creation, ma ultra-thin film detachment mo fausaga masini tūsaʻo po o heteroepitaxial layer transfer.