4 inisi SiC Wafers 6H Semi-Insulating SiC Substrates tulaga muamua, su'esu'ega, ma le togi fa'atusa.
Fa'amatalaga o oloa
| Vasega | Zero MPD Vasega Gaosia (Visi Z) | Vasega Gaosia Fa'ata'atia (Visi P) | Vasega Fa'ata (vaega D) | ||||||||
| Diamita | 99.5 mm~100.0 mm | ||||||||||
| 4H-SI | 500 μm±20 μm | 500 μm±25 μm | |||||||||
| Fa'asinomaga ole Wafer |
Tu'u ese: 4.0° aga'i i< 1120 > ± 0.5° mo le 4H-N, I luga ole axis: <0001>±0.5° mo le 4H-SI | ||||||||||
| 4H-SI | ≤1cm-2 | ≤5 cm-2 | ≤15 cm-2 | ||||||||
| 4H-SI | ≥1E9 Ω·cm | ≥1E5 Ω·cm | |||||||||
| Primary Flat Orientation | {10-10} ±5.0° | ||||||||||
| Primary Flat Umi | 32.5 mm±2.0 mm | ||||||||||
| Lua Mafolafola Umi | 18.0 mm±2.0 mm | ||||||||||
| Tulaga Lua mafolafola | Silisi fa'asaga i luga: 90° CW. mai Prime flat ±5.0° | ||||||||||
| Tuusaunoaga Tupito | 3 mm | ||||||||||
| LTV/TTV/Bow/Warp | ≤3 μm/≤5 μm/≤15 μm/≤30 μm | ≤10 μm/≤15 μm/≤25 μm/≤40 μm | |||||||||
| Talatala | C foliga | Polish | Ra≤1 nm | ||||||||
| Si foliga | CMP | Ra≤0.2 nm | Ra≤0.5 nm | ||||||||
| Ta'eta'e Tu'u I le Malamalama Maualuluga | Leai | Umi fa'aputu ≤ 10 mm, tasi umi≤2 mm | |||||||||
| Papatusi Hex I Malamalama Maualuga Maualuga | Vaega fa'aopoopo ≤0.05% | Vaega fa'aopoopo ≤0.1% | |||||||||
| Polytype Areas I le Malamalama Maualuga | Leai | Vaega fa'aopoopo≤3% | |||||||||
| Vaaiga Carbon Inclusions | Vaega fa'aopoopo ≤0.05% | Vaega fa'aopoopo ≤3% | |||||||||
| Susi Sili Sili I luga o le Malamalama Maualuga | Leai | Fa'aputuga umi≤1*diamita wafer | |||||||||
| Sisi Chips Maualuluga I Malosiaga Malamalama | Leai se fa'atagaina ≥0.2 mm le lautele ma le loloto | 5 faatagaina, ≤1 mm taitasi | |||||||||
| Silicon Surface Contamination I le Malosi Maualuga | Leai | ||||||||||
| afifiina | Tele-wafer kaseti po'o se atigi apa e tasi | ||||||||||
Auiliili Ata
Oloa Fa'atatau
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