4H-N HPSI SiC wafer 6H-N 6H-P 3C-N SiC Epitaxial wafer mo MOS po'o SBD

Fa'amatalaga Puupuu:

Fuafu lapoa Ituaiga SiC Vasega Talosaga
2-inisi 4H-N
4H-SEMI(HPSI)
6H-N
6H-P
3C-N
Palemia(Gaosiga)
Faafoliga
Suesuega
Malosiaga eletise, masini RF
3-inisi 4H-N
4H-SEMI(HPSI)
6H-P
3C-N
Palemia(Gaosiga)
Faafoliga
Suesuega
Malosiaga fa'afouina, aerospace
4-inisi 4H-N
4H-SEMI(HPSI)
6H-P
3C-N
Palemia(Gaosiga)
Faafoliga
Suesuega
Masini fa'apisinisi, fa'aoga maualuga
6-inisi 4H-N
4H-SEMI(HPSI)
6H-P
3C-N
Palemia(Gaosiga)
Faafoliga
Suesuega
Ta'avale, suiga malosi
8-inisi 4H-N
4H-SEMI(HPSI)
Palemia(Gaosiga) MOS/SBD
Faafoliga
Suesuega
Ta'avale eletise, masini RF
12-inisi 4H-N
4H-SEMI(HPSI)
Palemia(Gaosiga)
Faafoliga
Suesuega
Malosiaga eletise, masini RF

Vaega

N-ituaiga Fa'amatalaga & siata

HPSI Fa'amatalaga & siata

Epitaxial wafer Fa'amatalaga & siata

Q&A

SiC Substrate SiC Epi-wafer Puupuu

Matou te ofoina atu se vaega atoa o tulaga maualuga SiC substrates ma sic wafers i le tele o polytypes ma doping profiles-e aofia ai le 4H-N (n-type conductive), 4H-P (p-type conductive), 4H-HPSI (high-purity semi-insulating), ma le 6H-P (p-type conductive) -i le lautele, ma le 8″ uma, ma le 6″ ala uma, ma le 6″. 12″. I tua atu o mea e leai ni mea'ai, o la matou auaunaga fa'atupuina o le epi wafer e fa'aopoopoina le tau e tu'uina atu ai u'amea epitaxial (epi) ma le mafiafia fa'atonutonu lelei (1-20 µm), fa'atosina o le doping, ma le tele o faaletonu.

O sic wafer ma epi wafer e faia su'esu'ega i totonu ole laiga (micropipe density <0.1 cm⁻², fa'asaa o luga Ra <0.2 nm) ma fa'amatalaga eletise atoa (CV, fa'afanua resistivity) ina ia mautinoa le tulaga tutusa tioata ma le fa'atinoga. Pe faʻaaogaina mo masini eletise eletise, faʻaulu RF maualuga, poʻo masini optoelectronic (LEDs, photodetectors), o tatou SiC substrate ma epi wafer laina oloa e maua ai le faʻamaoni, faʻamautu vevela, ma le malepelepe malosi e manaʻomia e talosaga sili ona faigata i aso nei.

SiC Substrate 4H-N ituaiga o meatotino ma le fa'aogaina

  • 4H-N SiC substrate Polytype (Hexagonal) Fa'atulagaga

O le vaeluaga lautele o le ~ 3.26 eV faʻamautinoa le faʻaogaina o le eletise ma le malosi o le vevela i lalo o le maualuga o le vevela ma le maualuga o le eletise-eletise.

  • SiC mea'aiN-ituaiga Doping

O le fa'atonuina tonu o le nitrogen doping e maua mai ai le fa'aputuga mai le 1 × 10¹⁶ i le 1 × 10¹⁹ cm⁻³ ma le vevela o le potu e o'o atu i le ~900 cm²/V·s, fa'aitiitia le gau.

  • SiC mea'aiTele Resistivity & tutusa

O lo'o maua le resistivity va'aiga o le 0.01-10 Ω·cm ma le mafiafia wafer o le 350-650 µm fa'atasi ai ma le ±5% fa'apalepale i le doping ma le mafiafia-lelei mo le gaosiga o masini maualuga.

  • SiC mea'aiUltra-Maualalo Defect Density

Micropipe density <0.1 cm⁻² ma le basal-plane dislocation density <500 cm⁻², fa'aolaina > 99% le gaosiga o masini ma maualuga le fa'amaoni tioata.

  • SiC mea'aiTulaga Fa'aavevela Fa'avela

O le faʻafefe o le vevela e oʻo atu i le ~ 370 W / m · K e faʻafaigofie ai le faʻamalo lelei o le vevela, faʻamalosia le faʻatuatuaina o le masini ma le malosi malosi.

  • SiC mea'aiTalosaga Fa'atatau

SiC MOSFETs, Schottky diodes, eletise eletise ma masini RF mo ta'avale eletise, suiga ole la, ta'avale fale gaosimea, faiga fa'atosina, ma isi maketi mana'omia-eletise.

6inch 4H-N ituaiga SiC wafer faʻamatalaga

Meatotino Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
Vasega Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
Diamita 149.5 mm - 150.0 mm 149.5 mm - 150.0 mm
Poly-ituaiga 4H 4H
mafiafia 350 µm ± 15 µm 350 µm ± 25 µm
Fa'asinomaga ole Wafer Tu'u ese: 4.0° agai i le <1120> ± 0.5° Tu'u ese: 4.0° agai i le <1120> ± 0.5°
Micropipe Density ≤ 0.2 cm² ≤ 15 cm²
Tete'e 0.015 - 0.024 Ω·cm 0.015 - 0.028 Ω·cm
Primary Flat Orientation [10-10] ± 50° [10-10] ± 50°
Primary Flat Umi 475 mm ± 2.0 mm 475 mm ± 2.0 mm
Tuusaunoaga Tupito 3 mm 3 mm
LTV/TIV / Aufana / Warp ≤ 2.5 µm / ≤ 6 µm / ≤ 25 µm / ≤ 35 µm ≤ 5 µm / ≤ 15 µm / ≤ 40 µm / ≤ 60 µm
Talatala Polani Ra ≤ 1 nm Polani Ra ≤ 1 nm
CMP Ra ≤ 0.2 nm ≤ 0.5 nm
Ta'eta'e Tu'u I le Malamalama Maualuluga Umi fa'aputu ≤ 20 mm umi tasi ≤ 2 mm Umi fa'aputu ≤ 20 mm umi tasi ≤ 2 mm
Papatusi Hex I Malamalama Maualuga Maualuga Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 0.1%
Polytype Areas I le Malamalama Maualuga Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 3%
Vaaiga Carbon Inclusions Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 5%
Susi Sili Sili I luga o le Malamalama Maualuga Umi fa'aputu ≤ 1 le lautele o fafie
Tipi Chips E Malamalama Malosi Maualuga Leai se fa'atagaina ≥ 0.2 mm le lautele ma le loloto 7 faatagaina, ≤ 1 mm taitasi
Fa'a'ese'ese le fa'a siu filo <500 cm³ <500 cm³
Silicon Surface Contamination E le Malamalama Maualuga
afifiina Tele-wafer kaseti po'o se atigi apa e tasi Tele-wafer kaseti po'o se atigi apa e tasi

 

8inch 4H-N ituaiga SiC wafer's faʻamatalaga

Meatotino Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
Vasega Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
Diamita 199.5 mm - 200.0 mm 199.5 mm - 200.0 mm
Poly-ituaiga 4H 4H
mafiafia 500 µm ± 25 µm 500 µm ± 25 µm
Fa'asinomaga ole Wafer 4.0° agai i le <110> ± 0.5° 4.0° agai i le <110> ± 0.5°
Micropipe Density ≤ 0.2 cm² ≤ 5 cm²
Tete'e 0.015 - 0.025 Ω·cm 0.015 - 0.028 Ω·cm
Fa'atonuga mamalu
Tuusaunoaga Tupito 3 mm 3 mm
LTV/TIV / Aufana / Warp ≤ 5 µm / ≤ 15 µm / ≤ 35 µm / 70 µm ≤ 5 µm / ≤ 15 µm / ≤ 35 µm / 100 µm
Talatala Polani Ra ≤ 1 nm Polani Ra ≤ 1 nm
CMP Ra ≤ 0.2 nm ≤ 0.5 nm
Ta'eta'e Tu'u I le Malamalama Maualuluga Umi fa'aputu ≤ 20 mm umi tasi ≤ 2 mm Umi fa'aputu ≤ 20 mm umi tasi ≤ 2 mm
Papatusi Hex I Malamalama Maualuga Maualuga Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 0.1%
Polytype Areas I le Malamalama Maualuga Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 3%
Vaaiga Carbon Inclusions Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 5%
Susi Sili Sili I luga o le Malamalama Maualuga Umi fa'aputu ≤ 1 le lautele o fafie
Tipi Chips E Malamalama Malosi Maualuga Leai se fa'atagaina ≥ 0.2 mm le lautele ma le loloto 7 faatagaina, ≤ 1 mm taitasi
Fa'a'ese'ese le fa'a siu filo <500 cm³ <500 cm³
Silicon Surface Contamination E le Malamalama Maualuga
afifiina Tele-wafer kaseti po'o se atigi apa e tasi Tele-wafer kaseti po'o se atigi apa e tasi

 

4h-n sic wafer's application_副本

 

4H-SiC o se mea maualuga faʻatinoga faʻaaogaina mo eletise eletise, masini RF, ma faʻaoga maualuga-vevela. O le "4H" e faasino i le fausaga tioata, o le hexagonal, ma le "N" o loʻo faʻaalia ai se ituaiga doping e faʻaaogaina e faʻaleleia ai le faʻatinoga o mea.

O le4H-SiCituaiga e masani ona faʻaaogaina mo:

Malosiaga Fa'aeletonika:Fa'aoga i masini e pei o diodes, MOSFETs, ma IGBTs mo ta'avale eletise eletise, masini fale gaosi oloa, ma faiga fa'afouina.
5G Tekinolosi:Fa'atasi ai ma le mana'oga a le 5G mo vaega maualuga-telefoni ma maualuga-lelei, o le malosi o le SiC e fa'atautaia ai volita maualuga ma fa'agaoioi i le vevela maualuga e fa'amalieina ai mo fa'amalo eletise ma masini RF.
Faiga ole Malosiaga ole la:O mea lelei tele a le SiC e fa'aogaina ai le eletise e lelei mo photovoltaic (solar power) inverters ma converters.
Ta'avale eletise (EVs):O le SiC e faʻaaogaina lautele i EV powertrains mo le sili atu le lelei o le liua o le malosi, faʻaitiitia le vevela, ma le maualuga o le malosi.

SiC Substrate 4H Semi-Insulating ituaiga meatotino ma le fa'aogaina

Meatotino:

    • Fa'ata'ita'iga e pulea le mamafa e leai ni paipa: Faʻamautinoa le leai o ni micropipes, faʻaleleia le lelei o le substrate.

       

    • Monocrystalline fa'atonutonu auala: Faʻamaonia se fausaga tioata e tasi mo mea faʻaleleia atili.

       

    • Auala e pulea ai fa'aaofia: Faʻaitiʻitia le i ai o mea le mama poʻo mea faʻapipiʻi, faʻamautinoaina se mea mama mama.

       

    • Fa'atonuga fa'atonutonu: Fa'ataga mo le fa'atonu sa'o o le fa'afitia o le eletise, lea e taua tele mo le fa'atinoga o masini.

       

    • Fa'atonuga le mama ma faiga fa'atonutonu: Faʻatonutonu ma faʻatapulaʻaina le faʻaofiina o mea le mama e faʻamautu ai le faʻamaoni o meaʻai.

       

    • Fa'ata'ita'iga fa'atonutonu lautele laasaga: E maua ai le fa'atonuga sa'o i luga ole la'a lautele, fa'amautinoaina le tutusa i luga ole mea'ai

 

6Inisi 4H-semi SiC mea fa'apitoa

Meatotino Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
Diamita (mm) 145 mm - 150 mm 145 mm - 150 mm
Poly-ituaiga 4H 4H
Mafiafia (um) 500 ± 15 500 ± 25
Fa'asinomaga ole Wafer I luga ole axis: ± 0.0001° I luga ole axis: ±0.05°
Micropipe Density ≤ 15 cm-2 ≤ 15 cm-2
Tete'e (Ωcm) ≥ 10E3 ≥ 10E3
Primary Flat Orientation (0-10)° ± 5.0° (10-10)° ± 5.0°
Primary Flat Umi Notch Notch
Tuusaunoaga pito (mm) ≤ 2.5 µm / ≤ 15 µm ≤ 5.5 µm / ≤ 35 µm
LTV / tanoa / Warp ≤ 3 µm ≤ 3 µm
Talatala Polani Ra ≤ 1.5 µm Polani Ra ≤ 1.5 µm
Tipi Chips E Malamalama Malosi Maualuga ≤ 20 µm ≤ 60 µm
Papatusi vevela e ala i le malamalama maualuga Fa'aopoopo ≤ 0.05% Fa'aopoopo ≤ 3%
Polytype Areas I le Malamalama Maualuga Va'aiga Carbon Inclusions ≤ 0.05% Fa'aopoopo ≤ 3%
Susi Sili Sili I luga o le Malamalama Maualuga ≤ 0.05% Fa'aopoopo ≤ 4%
Tipi Chips I le Mamalu Mamalu Tele (Lapopoa) Le Fa'ataga > 02 mm Lautele ma Lele Le Fa'ataga > 02 mm Lautele ma Lele
O le Fa'aliga o le Screw Fesoasoani ≤ 500 µm ≤ 500 µm
Silicon Surface Contamination E le Malamalama Maualuga ≤ 1 x 10^5 ≤ 1 x 10^5
afifiina Tele-wafer kaseti po'o se atigipusa ta'i tasi Tele-wafer kaseti po'o se atigipusa ta'i tasi

4-Inisi 4H-Semi Insulating SiC Substrate Fa'amatalaga

Parameter Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
Meatotino Faaletino
Diamita 99.5 mm – 100.0 mm 99.5 mm – 100.0 mm
Poly-ituaiga 4H 4H
mafiafia 500 μm ± 15 μm 500 μm ± 25 μm
Fa'asinomaga ole Wafer I luga ole axis: <600h> 0.5° I luga ole axis: <000h> 0.5°
Eletise Meatotino
Malosi'i paipa (MPD) ≤1 cm⁻² ≤15 cm⁻²
Tete'e ≥150 Ω·cm ≥1.5 Ω·cm
Fa'apalepale Geometric
Primary Flat Orientation (0x10) ± 5.0° (0x10) ± 5.0°
Primary Flat Umi 52.5 mm ± 2.0 mm 52.5 mm ± 2.0 mm
Lua Mafolafola Umi 18.0 mm ± 2.0 mm 18.0 mm ± 2.0 mm
Tulaga Lua mafolafola 90° CW mai Prime flat ± 5.0° (Si fa'asaga i luga) 90° CW mai Prime flat ± 5.0° (Si fa'asaga i luga)
Tuusaunoaga Tupito 3 mm 3 mm
LTV / TTV / Aufana / Warp ≤2.5 μm / ≤5 μm / ≤15 μm / ≤30 μm ≤10 μm / ≤15 μm / ≤25 μm / ≤40 μm
Tulaga lelei
Fa'asaa ole Lau'ele'ele (Polani Ra) ≤1 nm ≤1 nm
Fa'asaa ole Lau'ele'ele (CMP Ra) ≤0.2 nm ≤0.2 nm
Ta'e Tu'u (Malu Malosi) E le faatagaina Umi fa'aputu ≥10 mm, ta'e tasi ≤2 mm
Fa'aletonu Papatu Hexagonal ≤0.05% vaega fa'aopoopo ≤0.1% vaega fa'aopoopo
Polytype Fa'aofi Vaega E le faatagaina ≤1% vaega fa'aopoopo
Vaaiga Carbon Inclusions ≤0.05% vaega fa'aopoopo ≤1% vaega fa'aopoopo
Mata'i Sili Sili E le faatagaina ≤1 umi fa'aputuga fa'aputuga o le lautele
Tipi Chips Leai se fa'atagaina (≥0.2 mm lautele/loloto) ≤5 meataalo (tasi ≤1 mm)
Silicon Laufanua Fa'aleaga E le o ta'ua E le o ta'ua
afifiina
afifiina Kaseti tele-wafer po'o se atigipusa tasi-wafer Tele-wafer kaseti po o


Talosaga:

O leSiC 4H Semi-Insulating substrateso loʻo faʻaaogaina muamua i masini eletise eletise maualuga ma maualuga, aemaise lava i leRF fanua. O nei substrates e taua tele mo faʻaoga eseese e aofia aifaiga fa'afeso'ota'i microwave, fa'asologa fa'asolosolo radar, mamasini eletise uaealesi. O le maualuga o le vevela ma le sili ona lelei o le eletise e mafai ai ona lelei mo le manaʻomia o talosaga i le eletise eletise ma fesoʻotaʻiga.

HPSI sic wafer-application_副本

 

SiC epi wafer 4H-N ituaiga o meatotino ma le faʻaogaina

SiC 4H-N Type Epi Wafer Meatotino ma Talosaga

 

Meatotino o SiC 4H-N Type Epi Wafer:

 

Meafaitino:

SiC (Silicon Carbide): E lauiloa mo lona maaa mataʻina, maualuga le vevela, ma mea lelei eletise, SiC e lelei mo masini eletise maualuga.
4H-SiC Polytype: O le 4H-SiC polytype ua lauiloa mo lona maualuga maualuga ma le mautu i mea faʻaeletoroni.
N-ituaiga Doping: N-type doping (doped with nitrogen) e maua ai le fa'aogaina lelei o le eletise, ma fa'atatau ai le SiC mo fa'aoga maualuga ma le malosi.

 

 

Amioga vevela maualuga:

SiC wafers e sili atu le fa'auluina o le vevela, e masani lava mai120–200 W/m·K, e mafai ai ona latou pulea lelei le vevela i masini maualuga e pei o transistors ma diodes.

Avanoa Lautele:

Faatasi ai ma se fusi o3.26 eV, 4H-SiC e mafai ona faʻaogaina i luga o voltage maualuga, alalaupapa, ma le vevela faʻatusatusa i masini faʻapipiʻi masani, faʻaogaina lelei mo le maualuga, faʻaoga maualuga.

 

Meatotino tau Eletise:

O le maualuga o le eletise eletise a le SiC ma le faʻaogaina e faʻalelei aieletise eletise, e ofoina atu le saoasaoa o suiga vave ma le maualuga o le taimi nei ma le malosi e faʻaogaina ai le eletise, e mafua ai le sili atu ona lelei le puleaina o le eletise.

 

 

Tete'e Fa'ainisinia ma Vailaau:

O le SiC o se tasi o mea sili ona faigata, lona lua i taimane, ma e matua tetee atu i le faʻamaʻiina ma le pala, ma faʻamalosia ai i siosiomaga faigata.

 

 


Fa'aoga ole SiC 4H-N Type Epi Wafer:

 

Malosiaga Fa'aeletonika:

SiC 4H-N ituaiga epi wafers o loʻo faʻaaogaina lautele imalosi MOSFETs, IGBTs, madiodesmoliua manai faiga e pei ola inverters, taavale eletise, mafaiga e teu ai le malosi, ofoina atu le faʻaleleia atili o le faʻatinoga ma le malosi o le malosi.

 

Ta'avale eletise (EVs):

In ta'avale eletise eletise, ta'avale afi, manofoaga e molia ai, SiC wafers fesoasoani e maua ai le sili atu le lelei o le maa, faʻapipiʻiina vave, ma faʻaleleia atili le faʻatinoga o le malosi ona o lo latou gafatia e taulimaina le malosi maualuga ma le vevela.

Malosiaga Fa'afouina:

Su'ega o le la: SiC wafers o loʻo faʻaaogaina ifaiga fa'aolamo le fa'aliliuina o le mana DC mai le la i le AC, fa'atuputeleina le lelei atoatoa o le faiga ma le fa'atinoga.
Savili Turbines: SiC tekonolosi o loʻo faʻaaogaina ifaiga e pulea ai le savili, fa'amalieina le gaosiga o le mana ma le fa'aliliuga lelei.

Aerospace ma Puipuiga:

SiC wafers e lelei mo le faʻaaogaina iaerospace faaeletonikamatalosaga faamiliteli, e aofia aifaiga radarmasatelite faaeletonika, lea e taua tele ai le fa'asaoina o fa'avevela ma le mautu o le vevela.

 

 

Talosaga Maualuluga ma Talosaga Talosaga:

SiC wafers e sili ona leleimea tau eletise maualuga, fa'aaogaina iafi vaalele, va'alele, mafaiga faamafanafana falegaosimea, a'o latou fa'atumauina le fa'atinoga i tulaga vevela tele. E le gata i lea, o lo latou vaeluaga lautele e mafai ai ona faʻaoga i totonufa'aoga maualugapeiRF masinimafeso'ota'iga microwave.

 

 

6-inisi N-ituaiga epit axial faʻamatalaga
Parameter iunite Z-MOS
Ituaiga Amioga / Dopant - N-ituaiga / Nitrogen
Laega Fa'amau Fa'asa'o Fa'alava Mafiafia um 1
Fa'apalepale Layer Mafiafia % ±20%
Fa'asa'o Fa'apa'u cm-3 1.00E+18
Fa'apalepale Fa'apalepale Layer Concentrate % ±20%
1st Epi Layer Epi Layer Mafiafia um 11.5
Epi Layer Mafiafia tutusa % ±4%
Epi Layers Mafiafia Fa'apalepale((Fa'amatalaga-
Max, Min)/Fa'amatalaga)
% ±5%
Epi Layer Concentration cm-3 1E 15~ 1E 18
Epi Layer Concentrate Onosa'i % 6%
Epi Layer Concentrate tutusa (σ
/uiga)
% ≤5%
Epi Layer Concentrate Uniformity
<(max-min)/(max+min>
% ≤ 10%
Epitaixal Wafer Shape punou um ≤±20
WARP um ≤30
TTV um ≤ 10
LTV um ≤2
Uiga Lautele Malosi umi mm ≤30mm
Tipi Chips - E LEAI
Fa'ailoga fa'aletonu ≥97%
(fuaina ile 2*2,
Fa'aleagaina fa'aletonu e aofia ai: Fa'aletonu e aofia ai
Micropipe / lua tetele, Karoti, Tafatolu
Fa'aleagaina uamea atoms/cm² d f f ll i
≤5E10 atoms/cm2 (Al, Cr, Fe, Ni, Cu, Zn,
Hg,Na,K,Ti, Ca &Mn)
afifi Fa'amatalaga fa'apipi'i pcs / pusa kaseti tele-wafer po'o se apa fa'apipi'i tasi

 

 

 

 

8-inisi N-ituaiga epitaxial faʻamatalaga
Parameter iunite Z-MOS
Ituaiga Amioga / Dopant - N-ituaiga / Nitrogen
Papa puipui Fa'asa'o Fa'alava Mafiafia um 1
Fa'apalepale Layer Mafiafia % ±20%
Fa'asa'o Fa'apa'u cm-3 1.00E+18
Fa'apalepale Fa'apalepale Layer Concentrate % ±20%
1st Epi Layer Epi Layers Mafiafia averesi um 8~ 12
Epi Layers Mafiafia tutusa (σ/mean) % ≤2.0
Fa'apalepale Mafiafia Lays Epi((Fa'amatalaga -Max, Min)/Fa'amatalaga) % ±6
Epi Layers Net Avemera Doping cm-3 8E+15 ~2E+16
Epi Layers Net Doping Uniformity (σ/mean) % ≤5
Epi Layers Net DopingTolerance((Spec -Max, % ± 10.0
Epitaixal Wafer Shape Mi )/S )
A'ai
um ≤50.0
punou um ± 30.0
TTV um ≤ 10.0
LTV um ≤4.0 (10mm×10mm)
lautele
Uiga
Masisi - Fa'aputuga umi≤ 1/2Wafer diameter
Tipi Chips - ≤2 tupe meataalo, radius taʻitasi≤1.5mm
Fa'aleaga uamea i luga atoms/cm2 ≤5E10 atoms/cm2 (Al, Cr, Fe, Ni, Cu, Zn,
Hg,Na,K,Ti, Ca &Mn)
Su'ega Fa'aletonu % ≥ 96.0
(2X2 faaletonu e aofia ai Micropipe / lua tetele,
Karoti, fa'aletonu tafatolu, Pa'u,
Linear/IGSF-s, BPD)
Fa'aleaga uamea i luga atoms/cm2 ≤5E10 atoms/cm2 (Al, Cr, Fe, Ni, Cu, Zn,
Hg,Na,K,Ti, Ca &Mn)
afifi Fa'amatalaga fa'apipi'i - kaseti tele-wafer po'o se apa fa'apipi'i tasi

 

 

 

 

SiC wafer's Q&A

Q1: O a ni fa'amanuiaga autu o le fa'aogaina o siC wafers i luga o fa'asolo fa'asolo masani i le eletise eletise?

A1:
SiC wafers e ofoina atu le tele o mea sili ona lelei nai lo le silicon masani (Si) wafers i le eletise eletise, e aofia ai:

Maualuga Maualuga: O le SiC e sili atu lona va'a (3.26 eV) pe a fa'atusatusa i le silicon (1.1 eV), e fa'atagaina ai masini e fa'agaoioi i voluma maualuga, alalaupapa, ma le vevela. O lenei mea e oʻo atu ai i le faʻaitiitia o le paʻu o le eletise ma sili atu le lelei i faiga faʻaliliuina eletise.
Amioga vevela maualuga: SiC's thermal conductivity e sili atu le maualuga nai lo le silicon, e mafai ai ona sili atu le faʻafefe o le vevela i faʻaoga maualuga-malosi, lea e faʻaleleia ai le faʻatuatuaina ma le ola o masini eletise.
Malosi maualuga ma le taimi nei taulima: O masini SiC e mafai ona faʻatautaia le maualuga o le voltage ma le tulaga o loʻo i ai nei, e faʻaogaina ai mo faʻaoga maualuga-malosi pei o taʻavale eletise, faʻafouina malosiaga faʻafouina, ma taʻavale afi.
Saosaoa Suiga Saosaoa: O masini SiC o loʻo i ai le vave faʻafesoʻotaʻi gafatia, lea e saofagā i le faʻaitiitia o le malosi o le gau ma le tele o le tino, ma faʻaogaina lelei mo faʻaoga maualuga.

 


Q2: O a faʻaoga autu a SiC wafers i totonu o pisinisi taʻavale?

A2:
I totonu o fale taʻavale, SiC wafers e faʻaaogaina muamua i:

Ta'avale eletise (EV) Powertrains: vaega fa'avae SiC peifa'afoligamamalosi MOSFETsfa'aleleia atili le lelei ma le fa'atinoina o ta'avale eletise e ala i le fa'agaoioia o suiga vave ma le maualuga o le malosi. E mafua ai le umi o le ola o le maa ma sili atu le lelei o le faatinoga o taavale.
Totogi i luga ole Laupapa: O masini SiC e fesoasoani e faʻaleleia le faʻaogaina o faiga faʻapipiʻi i luga o le laupapa e ala i le faʻavaveina o taimi faʻapipiʻi ma sili atu le puleaina o le vevela, lea e taua tele mo EVs e lagolago ai le maualuga o le eletise.
Faiga Fa'afoega o Ma'a (BMS): SiC tekinolosi faʻaleleia le lelei ofaiga pulea maa, e mafai ai ona sili atu tulafono faatonutonu voltage, sili atu le puleaina o le eletise, ma umi atu le ola o le maa.
Fa'aliliuga DC-DC: SiC wafers o loʻo faʻaaogaina iDC-DC liliue faaliliu ai le mana DC maualuga-voltage i le maualalo-voltage DC malosi sili atu ona lelei, lea e taua tele i taavale eletise e pulea ai le malosi mai le maa i vaega eseese o le taavale.
O le maualuga o le faatinoga a le SiC i le maualuga-voltage, maualuga-vevela, ma le maualuga o le faʻaogaina o talosaga e taua tele mo le faʻaogaina o pisinisi i le eletise.

 


  • Muamua:
  • Sosoo ai:

  • 6inch 4H-N ituaiga SiC wafer faʻamatalaga

    Meatotino Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
    Vasega Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
    Diamita 149.5 mm – 150.0 mm 149.5 mm – 150.0 mm
    Poly-ituaiga 4H 4H
    mafiafia 350 µm ± 15 µm 350 µm ± 25 µm
    Fa'asinomaga ole Wafer Tu'u ese: 4.0° agai i le <1120> ± 0.5° Tu'u ese: 4.0° agai i le <1120> ± 0.5°
    Micropipe Density ≤ 0.2 cm² ≤ 15 cm²
    Tete'e 0.015 – 0.024 Ω·cm 0.015 – 0.028 Ω·cm
    Primary Flat Orientation [10-10] ± 50° [10-10] ± 50°
    Primary Flat Umi 475 mm ± 2.0 mm 475 mm ± 2.0 mm
    Tuusaunoaga Tupito 3 mm 3 mm
    LTV/TIV / Aufana / Warp ≤ 2.5 µm / ≤ 6 µm / ≤ 25 µm / ≤ 35 µm ≤ 5 µm / ≤ 15 µm / ≤ 40 µm / ≤ 60 µm
    Talatala Polani Ra ≤ 1 nm Polani Ra ≤ 1 nm
    CMP Ra ≤ 0.2 nm ≤ 0.5 nm
    Ta'eta'e Tu'u I le Malamalama Maualuluga Umi fa'aputu ≤ 20 mm umi tasi ≤ 2 mm Umi fa'aputu ≤ 20 mm umi tasi ≤ 2 mm
    Papatusi Hex I Malamalama Maualuga Maualuga Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 0.1%
    Polytype Areas I le Malamalama Maualuga Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 3%
    Vaaiga Carbon Inclusions Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 5%
    Susi Sili Sili I luga o le Malamalama Maualuga Umi fa'aputu ≤ 1 le lautele o fafie
    Tipi Chips E Malamalama Malosi Maualuga Leai se fa'atagaina ≥ 0.2 mm le lautele ma le loloto 7 faatagaina, ≤ 1 mm taitasi
    Fa'a'ese'ese le fa'a siu filo <500 cm³ <500 cm³
    Silicon Surface Contamination E le Malamalama Maualuga
    afifiina Tele-wafer kaseti po'o se atigi apa e tasi Tele-wafer kaseti po'o se atigi apa e tasi

     

    8inch 4H-N ituaiga SiC wafer's faʻamatalaga

    Meatotino Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
    Vasega Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
    Diamita 199.5 mm – 200.0 mm 199.5 mm – 200.0 mm
    Poly-ituaiga 4H 4H
    mafiafia 500 µm ± 25 µm 500 µm ± 25 µm
    Fa'asinomaga ole Wafer 4.0° agai i le <110> ± 0.5° 4.0° agai i le <110> ± 0.5°
    Micropipe Density ≤ 0.2 cm² ≤ 5 cm²
    Tete'e 0.015 – 0.025 Ω·cm 0.015 – 0.028 Ω·cm
    Fa'atonuga mamalu
    Tuusaunoaga Tupito 3 mm 3 mm
    LTV/TIV / Aufana / Warp ≤ 5 µm / ≤ 15 µm / ≤ 35 µm / 70 µm ≤ 5 µm / ≤ 15 µm / ≤ 35 µm / 100 µm
    Talatala Polani Ra ≤ 1 nm Polani Ra ≤ 1 nm
    CMP Ra ≤ 0.2 nm ≤ 0.5 nm
    Ta'eta'e Tu'u I le Malamalama Maualuluga Umi fa'aputu ≤ 20 mm umi tasi ≤ 2 mm Umi fa'aputu ≤ 20 mm umi tasi ≤ 2 mm
    Papatusi Hex I Malamalama Maualuga Maualuga Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 0.1%
    Polytype Areas I le Malamalama Maualuga Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 3%
    Vaaiga Carbon Inclusions Vaega fa'aopoopo ≤ 0.05% Vaega fa'aopoopo ≤ 5%
    Susi Sili Sili I luga o le Malamalama Maualuga Umi fa'aputu ≤ 1 le lautele o fafie
    Tipi Chips E Malamalama Malosi Maualuga Leai se fa'atagaina ≥ 0.2 mm le lautele ma le loloto 7 faatagaina, ≤ 1 mm taitasi
    Fa'a'ese'ese le fa'a siu filo <500 cm³ <500 cm³
    Silicon Surface Contamination E le Malamalama Maualuga
    afifiina Tele-wafer kaseti po'o se atigi apa e tasi Tele-wafer kaseti po'o se atigi apa e tasi

    6Inisi 4H-semi SiC mea fa'apitoa

    Meatotino Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
    Diamita (mm) 145 mm – 150 mm 145 mm – 150 mm
    Poly-ituaiga 4H 4H
    Mafiafia (um) 500 ± 15 500 ± 25
    Fa'asinomaga ole Wafer I luga ole axis: ± 0.0001° I luga ole axis: ±0.05°
    Micropipe Density ≤ 15 cm-2 ≤ 15 cm-2
    Tete'e (Ωcm) ≥ 10E3 ≥ 10E3
    Primary Flat Orientation (0-10)° ± 5.0° (10-10)° ± 5.0°
    Primary Flat Umi Notch Notch
    Tuusaunoaga pito (mm) ≤ 2.5 µm / ≤ 15 µm ≤ 5.5 µm / ≤ 35 µm
    LTV / tanoa / Warp ≤ 3 µm ≤ 3 µm
    Talatala Polani Ra ≤ 1.5 µm Polani Ra ≤ 1.5 µm
    Tipi Chips E Malamalama Malosi Maualuga ≤ 20 µm ≤ 60 µm
    Papatusi vevela e ala i le malamalama maualuga Fa'aopoopo ≤ 0.05% Fa'aopoopo ≤ 3%
    Polytype Areas I le Malamalama Maualuga Va'aiga Carbon Inclusions ≤ 0.05% Fa'aopoopo ≤ 3%
    Susi Sili Sili I luga o le Malamalama Maualuga ≤ 0.05% Fa'aopoopo ≤ 4%
    Tipi Chips I le Mamalu Mamalu Tele (Lapopoa) Le Fa'ataga > 02 mm Lautele ma Lele Le Fa'ataga > 02 mm Lautele ma Lele
    O le Fa'aliga o le Screw Fesoasoani ≤ 500 µm ≤ 500 µm
    Silicon Surface Contamination E le Malamalama Maualuga ≤ 1 x 10^5 ≤ 1 x 10^5
    afifiina Tele-wafer kaseti po'o se atigipusa ta'i tasi Tele-wafer kaseti po'o se atigipusa ta'i tasi

     

    4-Inisi 4H-Semi Insulating SiC Substrate Fa'amatalaga

    Parameter Zero MPD Vasega Gaosia (Visi Z) Vasega Fa'ata (vaega D)
    Meatotino Faaletino
    Diamita 99.5 mm – 100.0 mm 99.5 mm – 100.0 mm
    Poly-ituaiga 4H 4H
    mafiafia 500 μm ± 15 μm 500 μm ± 25 μm
    Fa'asinomaga ole Wafer I luga ole axis: <600h> 0.5° I luga ole axis: <000h> 0.5°
    Eletise Meatotino
    Malosi'i paipa (MPD) ≤1 cm⁻² ≤15 cm⁻²
    Tete'e ≥150 Ω·cm ≥1.5 Ω·cm
    Fa'apalepale Geometric
    Primary Flat Orientation (0×10) ± 5.0° (0×10) ± 5.0°
    Primary Flat Umi 52.5 mm ± 2.0 mm 52.5 mm ± 2.0 mm
    Lua Mafolafola Umi 18.0 mm ± 2.0 mm 18.0 mm ± 2.0 mm
    Tulaga Lua mafolafola 90° CW mai Prime flat ± 5.0° (Si fa'asaga i luga) 90° CW mai Prime flat ± 5.0° (Si fa'asaga i luga)
    Tuusaunoaga Tupito 3 mm 3 mm
    LTV / TTV / Aufana / Warp ≤2.5 μm / ≤5 μm / ≤15 μm / ≤30 μm ≤10 μm / ≤15 μm / ≤25 μm / ≤40 μm
    Tulaga lelei
    Fa'asaa ole Lau'ele'ele (Polani Ra) ≤1 nm ≤1 nm
    Fa'asaa ole Lau'ele'ele (CMP Ra) ≤0.2 nm ≤0.2 nm
    Ta'e Tu'u (Malu Malosi) E le faatagaina Umi fa'aputu ≥10 mm, ta'e tasi ≤2 mm
    Fa'aletonu Papatu Hexagonal ≤0.05% vaega fa'aopoopo ≤0.1% vaega fa'aopoopo
    Polytype Fa'aofi Vaega E le faatagaina ≤1% vaega fa'aopoopo
    Vaaiga Carbon Inclusions ≤0.05% vaega fa'aopoopo ≤1% vaega fa'aopoopo
    Mata'i Sili Sili E le faatagaina ≤1 umi fa'aputuga fa'aputuga o le lautele
    Tipi Chips Leai se fa'atagaina (≥0.2 mm lautele/loloto) ≤5 meataalo (tasi ≤1 mm)
    Silicon Laufanua Fa'aleaga E le o ta'ua E le o ta'ua
    afifiina
    afifiina Kaseti tele-wafer po'o se atigipusa tasi-wafer Tele-wafer kaseti po o

     

    6-inisi N-ituaiga epit axial faʻamatalaga
    Parameter iunite Z-MOS
    Ituaiga Amioga / Dopant - N-ituaiga / Nitrogen
    Laega Fa'amau Fa'asa'o Fa'alava Mafiafia um 1
    Fa'apalepale Layer Mafiafia % ±20%
    Fa'asa'o Fa'apa'u cm-3 1.00E+18
    Fa'apalepale Fa'apalepale Layer Concentrate % ±20%
    1st Epi Layer Epi Layer Mafiafia um 11.5
    Epi Layer Mafiafia tutusa % ±4%
    Epi Layers Mafiafia Fa'apalepale((Fa'amatalaga-
    Max, Min)/Fa'amatalaga)
    % ±5%
    Epi Layer Concentration cm-3 1E 15~ 1E 18
    Epi Layer Concentrate Onosa'i % 6%
    Epi Layer Concentrate tutusa (σ
    /uiga)
    % ≤5%
    Epi Layer Concentrate Uniformity
    <(max-min)/(max+min>
    % ≤ 10%
    Epitaixal Wafer Shape punou um ≤±20
    WARP um ≤30
    TTV um ≤ 10
    LTV um ≤2
    Uiga Lautele Malosi umi mm ≤30mm
    Tipi Chips - E LEAI
    Fa'ailoga fa'aletonu ≥97%
    (fuaina ile 2*2,
    Fa'aleagaina fa'aletonu e aofia ai: Fa'aletonu e aofia ai
    Micropipe / lua tetele, Karoti, Tafatolu
    Fa'aleagaina uamea atoms/cm² d f f ll i
    ≤5E10 atoms/cm2 (Al, Cr, Fe, Ni, Cu, Zn,
    Hg,Na,K,Ti, Ca &Mn)
    afifi Fa'amatalaga fa'apipi'i pcs / pusa kaseti tele-wafer po'o se apa fa'apipi'i tasi

     

    8-inisi N-ituaiga epitaxial faʻamatalaga
    Parameter iunite Z-MOS
    Ituaiga Amioga / Dopant - N-ituaiga / Nitrogen
    Papa puipui Fa'asa'o Fa'alava Mafiafia um 1
    Fa'apalepale Layer Mafiafia % ±20%
    Fa'asa'o Fa'apa'u cm-3 1.00E+18
    Fa'apalepale Fa'apalepale Layer Concentrate % ±20%
    1st Epi Layer Epi Layers Mafiafia averesi um 8~ 12
    Epi Layers Mafiafia tutusa (σ/mean) % ≤2.0
    Fa'apalepale Mafiafia Lays Epi((Fa'amatalaga -Max, Min)/Fa'amatalaga) % ±6
    Epi Layers Net Avemera Doping cm-3 8E+15 ~2E+16
    Epi Layers Net Doping Uniformity (σ/mean) % ≤5
    Epi Layers Net DopingTolerance((Spec -Max, % ± 10.0
    Epitaixal Wafer Shape Mi )/S )
    A'ai
    um ≤50.0
    punou um ± 30.0
    TTV um ≤ 10.0
    LTV um ≤4.0 (10mm×10mm)
    lautele
    Uiga
    Masisi - Fa'aputuga umi≤ 1/2Wafer diameter
    Tipi Chips - ≤2 tupe meataalo, radius taʻitasi≤1.5mm
    Fa'aleaga uamea i luga atoms/cm2 ≤5E10 atoms/cm2 (Al, Cr, Fe, Ni, Cu, Zn,
    Hg,Na,K,Ti, Ca &Mn)
    Su'ega Fa'aletonu % ≥ 96.0
    (2X2 faaletonu e aofia ai Micropipe / lua tetele,
    Karoti, fa'aletonu tafatolu, Pa'u,
    Linear/IGSF-s, BPD)
    Fa'aleaga uamea i luga atoms/cm2 ≤5E10 atoms/cm2 (Al, Cr, Fe, Ni, Cu, Zn,
    Hg,Na,K,Ti, Ca &Mn)
    afifi Fa'amatalaga fa'apipi'i - kaseti tele-wafer po'o se apa fa'apipi'i tasi

    Q1: O a ni fa'amanuiaga autu o le fa'aogaina o siC wafers i luga o fa'asolo fa'asolo masani i le eletise eletise?

    A1:
    SiC wafers e ofoina atu le tele o mea sili ona lelei nai lo le silicon masani (Si) wafers i le eletise eletise, e aofia ai:

    Maualuga Maualuga: O le SiC e sili atu lona va'a (3.26 eV) pe a fa'atusatusa i le silicon (1.1 eV), e fa'atagaina ai masini e fa'agaoioi i voluma maualuga, alalaupapa, ma le vevela. O lenei mea e oʻo atu ai i le faʻaitiitia o le paʻu o le eletise ma sili atu le lelei i faiga faʻaliliuina eletise.
    Amioga vevela maualuga: SiC's thermal conductivity e sili atu le maualuga nai lo le silicon, e mafai ai ona sili atu le faʻafefe o le vevela i faʻaoga maualuga-malosi, lea e faʻaleleia ai le faʻatuatuaina ma le ola o masini eletise.
    Malosi maualuga ma le taimi nei taulima: O masini SiC e mafai ona faʻatautaia le maualuga o le voltage ma le tulaga o loʻo i ai nei, e faʻaogaina ai mo faʻaoga maualuga-malosi pei o taʻavale eletise, faʻafouina malosiaga faʻafouina, ma taʻavale afi.
    Saosaoa Suiga Saosaoa: O masini SiC o loʻo i ai le vave faʻafesoʻotaʻi gafatia, lea e saofagā i le faʻaitiitia o le malosi o le gau ma le tele o le tino, ma faʻaogaina lelei mo faʻaoga maualuga.

     

     

    Q2: O a faʻaoga autu a SiC wafers i totonu o pisinisi taʻavale?

    A2:
    I totonu o fale taʻavale, SiC wafers e faʻaaogaina muamua i:

    Ta'avale eletise (EV) Powertrains: vaega fa'avae SiC peifa'afoligamamalosi MOSFETsfa'aleleia atili le lelei ma le fa'atinoina o ta'avale eletise e ala i le fa'agaoioia o suiga vave ma le maualuga o le malosi. E mafua ai le umi o le ola o le maa ma sili atu le lelei o le faatinoga o taavale.
    Totogi i luga ole Laupapa: O masini SiC e fesoasoani e faʻaleleia le faʻaogaina o faiga faʻapipiʻi i luga o le laupapa e ala i le faʻavaveina o taimi faʻapipiʻi ma sili atu le puleaina o le vevela, lea e taua tele mo EVs e lagolago ai le maualuga o le eletise.
    Faiga Fa'afoega o Ma'a (BMS): SiC tekinolosi faʻaleleia le lelei ofaiga pulea maa, e mafai ai ona sili atu tulafono faatonutonu voltage, sili atu le puleaina o le eletise, ma umi atu le ola o le maa.
    Fa'aliliuga DC-DC: SiC wafers o loʻo faʻaaogaina iDC-DC liliue faaliliu ai le mana DC maualuga-voltage i le maualalo-voltage DC malosi sili atu ona lelei, lea e taua tele i taavale eletise e pulea ai le malosi mai le maa i vaega eseese o le taavale.
    O le maualuga o le faatinoga a le SiC i le maualuga-voltage, maualuga-vevela, ma le maualuga o le faʻaogaina o talosaga e taua tele mo le faʻaogaina o pisinisi i le eletise.

     

     

    Tusi lau savali iinei ma lafo mai ia i matou